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| NIIN: | 01-197-9533 | Item Name: | INC: | 41015 |
| FSC: | 5962 | Assignment Date: | CRIT: | IIG: | 41015 |
| ISC: | 2 | Date Standardized: | HMIC: | DODIC: |
| NSC: | 8 | Cancellation Date: | Jul-17-2000 | PMIC: | A | FIIG: | A458A0 |
| ESD: | Schedule B: | DEMIL: | B | DEMIL INT: |
| TIIC: | 1 | Originator: | ADPEC: | 0 | RPDMRC: |
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The full version of LogiQuest has information related to NSN 5962-01-197-9533 in each of the following databases.
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PROCUREMENT - Procurement History
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PID - Procurement Item Description
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D049 - Air Force End Items List
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D200F - Air Force Indentures
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ILS_INV - ILS Aviation Parts Availability
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WHEREUSED - Where NIIN Used
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CAGE - Commercial And Government Entity
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H6 - Federal Item Name Directory
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FSC - Federal Supply Class
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| Part Number | CAGE | Company | Status | RN CC | RN VC | DAC | RN AAC | RN FC | RN SC | RN JC | SADC | HCC | MSDS |
| 5926-8102401BXX | 67268 | DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT | H | 5 | 9 | ||||||||
| 5962-8102401BXB | 67268 | DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT | H | 5 | 2 | ||||||||
| 81024 | 67268 | DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT | H | 4 | 1 | ||||||||
| 8102401XB | 14933 | DEFENSE ELECTRONICS SUPPLY CENTER | H | 5 | 9 | ||||||||
| 8102401XB | 67268 | DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT | H | 2 | 2 | ||||||||
| HM4-6504S-8 | 34371 | RENESAS ELECTRONICS AMERICA INC | H | 5 | 1 |
| MOEC | SOS | A A C | R C | S L C | CIIC | U P Q | U S C | Unit Price | UI | UICF | MCD | Action Date | C/H |
| DS | S9E | D | 0 | 0 | $67.30 | EA | ------- | H |
| MRC | Requirement Statement | Reply Statement |
| ADAQ | BODY LENGTH | 0.345 INCHES MINIMUM AND 0.365 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.280 INCHES MINIMUM AND 0.305 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | M55.0/P125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | M65.0/P150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND STATIC OPERATION |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 15 INPUT |
| CRHL | BIT QUANTITY | 4096 |
| CSWJ | WORD QUANTITY | 4096 |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-9 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | M0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 14933-81024 DRAWING |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 FLAT LEADS |
| MOE Rule | Former MOER | Effective | AMC | AMSC | IMC | IMCA | Collaborators | Receivers |
| DTX1 | 3 | C |
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