|
National Stock Number(NSN): 5962-01-178-2741 (5962011782741, 011782741)
| NIIN: |
01-178-2741 |
Item Name: |
MICROCIRCUIT,LINEAR |
INC: |
31778
|
| FSC: |
5962
|
Assignment Date: |
May-03-1984 |
CRIT: |
X |
IIG: |
31778 |
| ISC: |
C |
Date Standardized: |
Jan-14-1997 |
HMIC: |
N |
DODIC: |
|
| NSC: |
5 |
Cancellation Date: |
Dec-01-2004 |
PMIC: |
A |
FIIG: |
A458A0 |
| ESD: |
D |
Schedule B: |
|
DEMIL: |
D |
DEMIL INT: |
|
| TIIC: |
4 |
Originator: |
TX |
ADPEC: |
0 |
RPDMRC: |
6 |
| NIIN: |
01-263-0950 |
Item Name: |
MICROCIRCUIT,HYBRID |
| FSC: |
5962 |
Replacement Date: |
Dec-01-2004 |
|
INC: |
41014 |
| Part Number |
CAGE |
Company |
Status |
RN CC |
RN VC |
DAC |
RN AAC |
RN FC |
RN SC |
RN JC |
SADC |
HCC |
MSDS |
|
3310873 |
77068
|
ALLIED-SIGNAL INC DBA ALLIED-SIGNAL AEROSPACE CO ELECTRODYNAMICS DIV |
H |
3 |
2 |
2 |
9Z |
|
D |
|
|
|
|
|
3322073-02 |
60225
|
L3 TECHNOLOGIES, INC. |
H |
C |
1 |
5 |
ZZ |
|
|
|
AC |
|
|
|
LH0002H/883 |
27014
|
NATIONAL SEMICONDUCTOR CORPORATION |
H |
5 |
1 |
6 |
ZZ |
|
|
|
|
|
|
|
SH0002HMQB |
07263
|
FAIRCHILD SEMICONDUCTOR CORP |
H |
5 |
1 |
6 |
ZZ |
|
|
|
|
|
|
| MOEC |
SOS |
A A C |
R C |
S L C |
CIIC |
U P Q |
U S C |
Unit Price |
UI |
UICF |
MCD |
Action Date |
C/H |
| DN |
S9E |
Y |
|
0 |
7 |
1 |
N |
$88.35 |
EA |
|
9NDH--2 |
Jul-01-2004 |
H |
| DS |
S9E |
Y |
|
0 |
7 |
1 |
D |
$88.35 |
EA |
|
------- |
Jul-01-2004 |
H |
| MOEC |
PC |
Phrase |
QPA |
UOM |
OOU |
JTC |
| DN |
Z |
DISCNT USE 5962-01-263-0950 |
000 |
|
|
|
| DS |
Z |
DISCNT USE 5962-01-263-0950 |
000 |
|
|
|
Technical Characteristics Information
| MRC |
Requirement Statement |
Reply Statement |
| ADAQ |
BODY LENGTH |
0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| ADAR |
BODY OUTSIDE DIAMETER |
0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 CELSIUS |
| CBBL |
FEATURES PROVIDED |
HYBRID AND HIGH CURRENT AND BURN IN, MIL-STD-883, CLASS B |
| CQSJ |
INCLOSURE MATERIAL |
METAL |
| CQSZ |
INCLOSURE CONFIGURATION |
CAN |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 AMPLIFIER, CURRENT |
| CWSG |
TERMINAL SURFACE TREATMENT |
TIN OR SOLDER |
| SPCL |
SPECIAL TEST FEATURES |
TESTED PER BENDIX DWG 3310873 |
| MOE Rule |
Former MOER |
Effective |
AMC |
AMSC |
IMC |
IMCA |
Collaborators |
Receivers |
| ZG01 |
|
Apr-01-1991 |
|
|
|
|
ZG |
ZG |
| Source: |
P |
Primary Inventory Control Activity (PICA) |
Status: |
H |
| Pri/Sec ICC: |
P |
Container NSN: |
|
Category Code: |
ZZZ0 |
| Lvl A Pkg Req: |
E |
Unit Pack Size: |
3.0x2.0x2.0 |
Pres Material: |
00 |
| Lvl B Pkg Req: |
Q |
Unit Pack Weight: |
0.3 |
Pres Method: |
C4 |
| Lvl C Pkg Req: |
Q |
Unit Pack Cube: |
0.007 |
Wrapping Mat: |
XX |
| Opt Proc Ind: |
M |
Unpkg Item Dims: |
|
Spec Marking: |
00 |
| Container FSC: |
|
SPI Number: |
|
SPI Revision: |
|
| Unpkg Weight: |
|
SPI Date: |
|
Pkg Design Activity: |
|
| Inter Container Qty: |
|
Inter Container Code: |
XX |
Clean/Dry Procedure: |
1 |
| Unit Container: |
EC |
Item Type Storage: |
A |
Unit Container Level: |
O |
| |
|
Cush/Dun Material: |
XX |
Cush/Dun Thickness: |
X |
|