|
National Stock Number(NSN): 5962-01-176-9221 (5962011769221, 011769221)
| NIIN: |
01-176-9221⛔ |
Item Name: |
MICROCIRCUIT,MEMORY |
INC: |
41015
|
| FSC: |
5962
|
Assignment Date: |
Apr-17-1984 |
CRIT: |
X |
IIG: |
41015 |
| ISC: |
3 |
Date Standardized: |
Jun-25-2003 |
HMIC: |
N |
DODIC: |
|
| NSC: |
5 |
Cancellation Date: |
Apr-01-2008 |
PMIC: |
A |
FIIG: |
A458A0 |
| ESD: |
B |
Schedule B: |
|
DEMIL: |
A |
DEMIL INT: |
|
| TIIC: |
4 |
Originator: |
TX |
ADPEC: |
0 |
RPDMRC: |
3 |
| NIIN: |
01-139-4097 |
Item Name: |
MICROCIRCUIT,MEMORY |
| FSC: |
5962 |
Replacement Date: |
Apr-01-2008 |
|
INC: |
41015 |
| Part Number |
CAGE |
Company |
Status |
RN CC |
RN VC |
DAC |
RN AAC |
RN FC |
RN SC |
RN JC |
SADC |
HCC |
MSDS |
|
13084302 |
04939
|
LOCKHEED MARTIN CORPORATION |
H |
3 |
2 |
5 |
TX |
|
|
|
|
|
|
|
13084302 |
58260
|
PROGRAM MANAGER ADVANCED ATTACK HELICOPTER BARCOM AMCPM-AAH |
H |
5 |
9 |
A |
TX |
|
B |
|
|
|
|
|
MKB4801AJ-81 |
50088
|
STMICROELECTRONICS INC |
H |
5 |
1 |
E |
TX |
|
|
|
|
|
|
|
SYC2159/883B |
55576
|
SYNERTEK |
H |
5 |
9 |
6 |
TX |
|
B |
|
|
|
|
| MOEC |
SOS |
A A C |
R C |
S L C |
CIIC |
U P Q |
U S C |
Unit Price |
UI |
UICF |
MCD |
Action Date |
C/H |
| DA |
S9E |
V |
Z |
0 |
U |
0 |
A |
$63.75 |
EA |
|
Q2200X- |
Oct-01-2002 |
H |
| DS |
S9E |
J |
|
0 |
U |
0 |
D |
$62.19 |
EA |
|
------- |
Oct-01-2001 |
H |
| MOEC |
PC |
Phrase |
QPA |
UOM |
OOU |
JTC |
| DA |
V |
DISCONTINUED W/O REPLACEMENT |
000 |
|
|
|
Technical Characteristics Information
| MRC |
Requirement Statement |
Reply Statement |
| ADAQ |
BODY LENGTH |
1.290 INCHES MAXIMUM |
| ADAT |
BODY WIDTH |
0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.210 INCHES MAXIMUM |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.0 WATTS |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 CELSIUS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 CELSIUS |
| CBBL |
FEATURES PROVIDED |
STATIC OPERATION |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC OR GLASS OR METAL |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| CQWX |
OUTPUT LOGIC FORM |
N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP |
INPUT CIRCUIT PATTERN |
22 INPUT |
| CRHL |
BIT QUANTITY |
8192 |
| CSWJ |
WORD QUANTITY |
1024 |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
D-3 MIL-M-38510 |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ |
TIME RATING PER CHACTERISTIC |
120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZER |
MEMORY DEVICE TYPE |
RAM |
| TEST |
TEST DATA DOCUMENT |
58260-13084302 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| TTQY |
TERMINAL TYPE AND QUANTITY |
24 PRINTED CIRCUIT |
Replacement & Obsolete Information
| Replaced / Replacement NIIN Information |
| FSC |
NIIN |
ISC |
Originator |
NSC |
Std. Date |
Status |
|
5962
|
01-139-4097
|
1 |
TX |
0 |
Jan-20-1998 |
H |
| Pri/Sec ICC: |
P |
Container NSN: |
|
Category Code: |
69F0 |
| Lvl A Pkg Req: |
E |
Unit Pack Size: |
|
Pres Material: |
XX |
| Lvl B Pkg Req: |
Q |
Unit Pack Weight: |
0.1 |
Pres Method: |
C4 |
| Lvl C Pkg Req: |
U |
Unit Pack Cube: |
0.001 |
Wrapping Mat: |
XX |
| Opt Proc Ind: |
|
Unpkg Item Dims: |
|
Spec Marking: |
39 |
| Container FSC: |
|
SPI Number: |
|
SPI Revision: |
|
| Unpkg Weight: |
|
SPI Date: |
|
Pkg Design Activity: |
14933
|
| Inter Container Qty: |
XXX |
Inter Container Code: |
XX |
Clean/Dry Procedure: |
X |
| Unit Container: |
XX |
Item Type Storage: |
|
Unit Container Level: |
|
| |
|
Cush/Dun Material: |
XX |
Cush/Dun Thickness: |
X |
|