|
National Stock Number(NSN): 5961-00-837-1395 (5961008371395, 008371395)
| NIIN: |
00-837-1395⛔ |
Item Name: |
SEMICONDUCTOR DEVICE,DIODE |
INC: |
20589
|
| FSC: |
5961
|
Assignment Date: |
Jan-01-1960 |
CRIT: |
X |
IIG: |
20589 |
| ISC: |
3 |
Date Standardized: |
May-01-1966 |
HMIC: |
N |
DODIC: |
|
| NSC: |
0 |
Cancellation Date: |
|
PMIC: |
U |
FIIG: |
A110A0 |
| ESD: |
A |
Schedule B: |
8541.10.0070 |
DEMIL: |
Q |
DEMIL INT: |
|
| TIIC: |
1 |
Originator: |
TX |
ADPEC: |
|
RPDMRC: |
|
| Part Number |
CAGE |
Company |
Status |
RN CC |
RN VC |
DAC |
RN AAC |
RN FC |
RN SC |
RN JC |
SADC |
HCC |
MSDS |
|
1N1782A |
04713
|
FREESCALE SEMICONDUCTOR, INC. |
C |
5 |
9 |
X |
XX |
3 |
D |
|
|
|
|
|
1N1782A |
1VPW8
|
GENERAL DYNAMICS MISSION SYSTEMS, INC. |
C |
5 |
9 |
5 |
ZZ |
|
|
|
|
|
|
|
1N1782A |
80131
|
ELECTRONIC INDUSTRIES ASSOCIATION |
C |
3 |
9 |
X |
XX |
3 |
D |
|
|
|
|
|
1N1782A |
94990
|
MOTOROLA |
C |
5 |
9 |
X |
XX |
3 |
B |
|
|
|
|
|
7901749-118 |
24617
|
GENERAL MOTORS CORP |
C |
5 |
2 |
X |
XX |
3 |
D |
|
|
|
|
|
7901749-118 |
99974
|
DELCO ELECTRONICS CORP DELCO SYSTEMS OPNS |
C |
5 |
9 |
X |
XX |
3 |
B |
|
|
|
|
Technical Characteristics Information
| MRC |
Requirement Statement |
Reply Statement |
| ABHP |
OVERALL LENGTH |
0.570 INCHES MAXIMUM |
| ABJT |
TERMINAL LENGTH |
1.000 INCHES MINIMUM AND 1.625 INCHES MAXIMUM |
| ADAV |
OVERALL DIAMETER |
0.215 INCHES MINIMUM AND 0.235 INCHES MAXIMUM |
| AFZC |
FUNCTION FOR WHICH DESIGNED |
ZENER DIODE |
| ALAZ |
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION |
DO-13 |
| AXGY |
MOUNTING METHOD |
TERMINAL |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED CASE |
| CTQN |
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC |
30.0 MAXIMUM NOMINAL REGULATOR VOLTAGE |
| CTQS |
VOLTAGE TOLERANCE IN PERCENT |
-5.0 TO 5.0 |
| CTQX |
CURRENT RATING PER CHARACTERISTIC |
15.00 MILLIAMPERES NOMINAL VOLTAGE REGULATOR DIODE CURRENT |
| CTRD |
POWER RATING PER CHARACTERISTIC |
1.0 WATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| MATT |
MATERIAL |
GLASS ENCLOSURE |
| MATT |
MATERIAL |
SILICON SEMICONDUCTOR |
| TTQY |
TERMINAL TYPE AND QUANTITY |
2 UNINSULATED WIRE LEAD |
| MOE Rule |
Former MOER |
Effective |
AMC |
AMSC |
IMC |
IMCA |
Collaborators |
Receivers |
| YD01 |
|
Mar-01-2017 |
|
|
|
|
YD |
YD |
| ZC01 |
|
Apr-01-1991 |
|
|
|
|
ZC |
ZC |
| ZR01 |
|
Dec-01-2007 |
|
|
|
|
ZR |
ZR |
Replacement & Obsolete Information
| Replaced / Replacement NIIN Information |
| FSC |
NIIN |
ISC |
Originator |
NSC |
Std. Date |
Status |
|
5961
|
00-892-0919
|
1 |
TX |
0 |
May-01-1966 |
C |
| Obsolete NIIN Information |
| Source: |
A |
Packaging Data Record contains data that does not meet current MIL-STD-2073-1C/D formats |
Status: |
C |
| Pri/Sec ICC: |
P |
Container NSN: |
|
Category Code: |
69F0 |
| Lvl A Pkg Req: |
Q |
Unit Pack Size: |
|
Pres Material: |
XX |
| Lvl B Pkg Req: |
Q |
Unit Pack Weight: |
0.0 |
Pres Method: |
96 |
| Lvl C Pkg Req: |
6 |
Unit Pack Cube: |
0.000 |
Wrapping Mat: |
XX |
| Opt Proc Ind: |
O |
Unpkg Item Dims: |
|
Spec Marking: |
00 |
| Container FSC: |
|
SPI Number: |
|
SPI Revision: |
|
| Unpkg Weight: |
|
SPI Date: |
|
Pkg Design Activity: |
14933
|
| Inter Container Qty: |
XXX |
Inter Container Code: |
XX |
Clean/Dry Procedure: |
X |
| Unit Container: |
XX |
Item Type Storage: |
|
Unit Container Level: |
|
| |
|
Cush/Dun Material: |
XX |
Cush/Dun Thickness: |
X |
|