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H6 - Federal Item Name Directory
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61653
HEAT SINK,SOLDERING AID
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FIIG: T166-T
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Entry Date: Apr-01-1974
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Concept:
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Status: A
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Applicability: TA
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Type: 0
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Definition: An item for dissipating heat during soldering operations which incorporates either a liquid absorbent in the form of foam or gel, or a metallic absorbent. The metallic absorbent is designed for attachment to heat sensitive components, such as diodes or transistors, to prevent thermal changes. Excludes: HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENTS.
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Corresponding NIINs: 63
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